METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
A method for forming a laminated structure in which four or more chips are laminated together includes at least a step of laminating a first chip sub-block comprised of a plurality of laminated chips together with a second chip sub-block comprised of a plurality of laminated chips.
1 . A method for forming a laminated structure in which four or more chips are laminated together, comprising the step of laminating a first chip sub-block comprised of a plurality of laminated chips together with a second chip sub-block comprised of a plurality of laminated chips.
2 . The method according to claim 1 , further comprising the step of forming a laminated structure comprised of a final chip block by laminating the first chip sub-block and the second chip sub-block as a final lamination step.
3 . The method according to claim 1 , wherein at least either the first chip sub-block or the second chip sub-block is formed by laminating a third chip sub-block comprised of a plurality of laminated chips together with a fourth chip sub-block comprised of a plurality of laminated chips.
4 . The method according to claim 1 , wherein at least either the first chip sub-block or a second chip sub-block is formed by laminating a third chip sub-block comprised of a plurality of laminated chips together with a single chip.
5 . The method according to claim 1 ,
wherein the number of laminated layers in the laminated structure is an even number equal to or greater than four; and
further comprising a first step in which all chips are paired together, and a plurality of two-chip sub-blocks are formed by laminating the paired chips together.
6 . The method according to claim 1 ,
wherein the number of laminated layers in the laminated structure is an odd number equal to or greater than five; and
further comprising a first step in which all chips except for one chip are paired together, and a plurality of two-chip sub-blocks are formed by laminating the paired chips together.
7 . The method according to claim 1 , further comprising the step of applying a liquid resin to at least a portion of one surface of the chip before conducting each of the lamination steps.
8 . The method according to claim 1 , further comprising the step of applying a film resin to at least one surface of the chip before conducting each of the lamination steps.
9 . A method for forming a laminated structure formed by laminating together an even number of chips equal to or greater than four, comprising the steps of:
forming a plurality of two-chip sub-blocks by pairing all chips together, and laminating the paired chips together; and
forming a final chip block by laminating a first chip sub-block comprised of a plurality of laminated chips together with a second chip sub-block comprised of a plurality of laminated chips, at least either the first chip sub-block or the second chip sub-block formed by laminating a third chip sub-block comprised of a plurality of laminated chips together with a fourth chip sub-block comprised of a plurality of laminated chips.
10 . A method for forming a laminated structure formed by laminating together an odd number of chips equal to or greater than five, comprising the steps of:
forming a plurality of two-chip sub-blocks by paring all chips together except for one chip, and by laminating the paired chips together.
forming a final chip block by laminating a first chip sub-block comprised of a plurality of laminated chips together with a second chip sub-block comprised of a plurality of laminated chips, at least either the first chip sub-block or the second chip sub-block formed by laminating a third chip sub-block comprised of a plurality of laminated chips together with a single chip.