Patent Assignment
Reel/Frame 017360/0814
Assignment of Assignor's Interest
Recorded: 2005-12-12
Pages: 2
Assignee
ASM ASSEMBLY AUTOMATION LTD.
20/F., WATSON CENTRE, 16-22 KUNG YIP ST., KWAI CHUNG, HONG KONG, SAR, CHINA
Covered Property
(1)
High Precision Die Bonding Apparatus