IP Library › Assignment 017367/0079
Patent Assignment
Reel/Frame 017367/0079

Assignment of Assignor's Interest

Recorded: 2005-12-22 Pages: 2
Assignors
LEE, YOUNG KI
Executed: 2005-12-16
CHOI, SEOG MOON
Executed: 2005-12-16
KIM, YONG SIK
Executed: 2005-12-16
SHIN, SANG HYUN
Executed: 2005-12-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fabrication Method of Light Emitting Diode Package
Patent: 7,268,014 →
Application: 11/314,003 →
Publication: US 2006/0246617
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →