Assignment of Assignor's Interest

Recorded: 2005-05-23 Pages: 2

Assignors

NISHIYAMA, TOMOHIRO

Executed: 2005-05-12

TAGO, MASAMOTO

Executed: 2005-05-12

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor Device, Wiring Substrate, and Method for Manufacturing Wiring Substrate

Patent: 7,728,439 →

Application: 10/536,025 →

Publication: US 2006/0151870

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.