Patent Assignment
Reel/Frame 017373/0836
Assignment of Assignor's Interest
Recorded: 2005-12-15
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING GO. LTD.
NO. 8 LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Package Structure with Constraint Stiffener for Cleaning and Underfilling Efficiency