Patent Assignment
Reel/Frame 017375/0259
Assignment of Assignor's Interest
Recorded: 2005-12-19
Pages: 3
Assignor
IKEDA, TOMOYUKI
Executed: 2005-12-08
Assignee
IBIDEN CO., LTD.
2-1, KANDACHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Multilayer Core Board and Manufacturing Method Thereof