Patent Assignment
Reel/Frame 017375/0388
Assignment of Assignor's Interest
Recorded: 2005-12-22
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Enhanced Heat Dissipation and Method of Fabricating the Same