IP Library › Assignment 017376/0982
Patent Assignment
Reel/Frame 017376/0982

Assignment of Assignor's Interest

Recorded: 2005-12-15 Pages: 6
Assignors
ROOZEBOOM, FREDDY
Executed: 2005-01-12
BUIJSMAN, ADRIANUS ALPHONSUS JOZEF
Executed: 2005-01-14
GAMAND, PATRICE
Executed: 2005-01-17
HUBERT, GERARDUS TARCISIUS MARIA
Executed: 2005-01-20
Assignee
KONINKLIJKE PHILIPS ELECTRONICS, N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property (1)
Electronic Device, Assembly and Methods of Manufacturing an Electronic Device Including a Vertical Trench Capacitor and a Vertical Interconnect
Patent: 9,530,857 →
Application: 10/560,717 →
Publication: US 2006/0131691
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest Apr 8, 2014
From: NXP B.V.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032626/0262 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →