Assignment of Assignor's Interest

Recorded: 2006-01-03 Pages: 3

Assignor

HONG, JI HO

Executed: 2005-12-23

Assignee

DONGBUANAM SEMICONDUCTOR INC.

891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF

Covered Property (1)

Method of forming metal wiring in a semiconductor device

Application: 11/320,705 →

Publication: US 2007/0077755

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.