IP Library Assignment 017407/0671
Patent Assignment
Reel/Frame 017407/0671

Assignment of Assignor's Interest

Recorded: 2005-12-22 Pages: 3
Assignors
SUH, DAEWOONG
Executed: 2005-12-22
RARAVIKAR, NACHIKET R.
Executed: 2005-12-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Nanostructure-Based Package Interconnect
Patent: 7,371,674 →
Application: 11/315,532 →
Publication: US 2007/0148949