Assignment of Assignor's Interest

Recorded: 2005-12-30 Pages: 2

Assignor

KIM, SANG SIK

Executed: 2005-12-28

Assignee

DONGBU-ANAM SEMICONDUCTOR INC.

891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF

Covered Property (1)

Method of fabricating an image sensor having a capping layer formed on the microlens being removed in the pad area.

Application: 11/320,948 →

Publication: US 2007/0102716

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.