Assignment of Assignor's Interest

Recorded: 2005-12-30 Pages: 2

Assignor

HONG, JI HO

Executed: 2005-12-23

Assignee

DONGBUANAM SEMICONDUCTOR INC.

891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF

Covered Property (1)

Apparatus and method for electrically contacting wafer in electronic chemical plating cell

Application: 11/320,621 →

Publication: US 2007/0056856

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.