Patent Assignment
Reel/Frame 018099/0281
Change of Name
Recorded: 2006-07-13
Pages: 11
Assignor
DONGBUANAM SEMICONDUCTOR INC.
Executed: 2006-03-24
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Properties
(40)
Method for Fabricating Flash Memory Device
Flash Memory Device and Method for Fabricating the Same, and Programming and Erasing Method Thereof
Cmos Image Sensor and Method for Detecting Color Sensitivity Thereof
Complementary Metal Oxide Semiconductor Image Sensor and Method for Fabricating the Same
Cmos Image Sensor and Method for Fabricating the Same
Non-Volatile Memory Device and Fabricating Method Thereof
Method of Fabricating Flash Memory Device
Method of Fabricating Non-Volatile Memory Device
Trench Isolation Method in Flash Memory Device
Non-Volatile Memory Device and Fabricating Method Thereof
Method of fabricating flash memory device having trench isolation
Application:
11/019,315 →
Publication:
US 2005/0142746
Device Isolation Method of Semiconductor Memory Device and Flash Memory Device Fabricating Method Using the Same
Method of fabricating high voltage device using double epitaxial growth
Application:
11/020,476 →
Publication:
US 2005/0179092
Image Sensor Having a Partial Light-Shielding Layer and Method for Fabricating the Same
Cmos Image Sensor
Image Sensor and Method for Fabricating the Same
Complementary Metal Oxide Semiconductor Image Sensor and Method for Fabricating the Same
Method of Forming Gate of Flash Memory Cell
Method of Fabricating Self-Aligned Bipolar Transistor
Method of Fabricating Semiconductor Device by Using Sacrifice Layer for Forming Diffusion Regions
Cmos Image Sensor and Method for Fabricating the Same
Semiconductor device and fabricating method thereof
Application:
11/022,832 →
Publication:
US 2005/0145931
Method of Fabricating High-Voltage Cmos Device
Method for Fabricating an Image Sensor Having Dual Micro-Lens
SONOS device and fabricating method thereof
Application:
11/022,878 →
Publication:
US 2005/0141285
CMOS image sensor and method for fabricating the same
Application:
11/022,886 →
Publication:
US 2005/0139878
Flash Memory Device and Programming and Erasing Methods Therewith
Cmos Image Sensor and Method for Fabricating the Same
Cmos Image Sensor and Method of Fabricating the Same
Method for Fabricating Semiconductor Device
Nonvolatile Memory Device Capable of Preventing Over-Erasure via Modified Tunneling Through a Double Oxide Layer Between a Floating Gate and a Control Gate.
Cmos Image Sensor and Method for Fabricating the Same
Method for Fabricating Image Sensor
Method for Manufacturing Cmos Image Sensor
Method and Apparatus for Chemical Mechanical Polishing
Apparatus and method for electrically contacting wafer in electronic chemical plating cell
Application:
11/320,621 →
Publication:
US 2007/0056856
Semiconductor Device and Method for Manufacturing the Same Including Two Antireflective Coating Films
Tungsten Plug Structure of Semiconductor Device and Method for Forming the Same
Method for Manufacturing Semiconductor Device
Method for Forming Metal Line of Semiconductor Device
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 29, 2004
From: MIN, WI SIK
To: DONGBU ELECTRONICS CO. LTD.
Reel/Frame 015643/0086 →
Assignment of Assignor's Interest
Jul 29, 2004
From: MIN, WI SIK
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015641/0804 →
Assignment of Assignor's Interest
Oct 13, 2004
From: LEE, SANG BUM
To: ANAM SEMICONDUCTOR LTD.
Reel/Frame 015881/0202 →
Assignment of Assignor's Interest
Nov 29, 2004
From: LEE, SANG BUM
To: ANAM SEMICONDUCTOR LTD.
Reel/Frame 016025/0754 →
Assignment of Assignor's Interest
Dec 2, 2004
From: IN GYUN, JEON
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 016053/0865 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUNG MUN; KIM, JUM SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016122/0942 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUNG MUN; KIM, JUM SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016123/0966 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUNG MUN; KIM, JUN SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016121/0335 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUNG MUN; KIM, JUM SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016121/0385 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUNG MUN; KIM, JUM SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016121/0678 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUNG MUN; KIM, JUM SOO
To: DONGBUANAM SEMICONDUTOR INC.
Reel/Frame 016122/0023 →
Assignment of Assignor's Interest
Dec 23, 2004
From: JUNG, SUN MUN; KIM, JUM SOO
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016122/0077 →
Assignment of Assignor's Interest
Dec 27, 2004
From: HAN, CHANG HUN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016129/0465 →
Assignment of Assignor's Interest
Dec 27, 2004
From: KO, KWANG YOUNG
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016131/0149 →
Assignment of Assignor's Interest
Dec 27, 2004
From: KIM, YOUNG ROK
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016129/0410 →
Assignment of Assignor's Interest
Dec 28, 2004
From: SHIM, HEE SUNG
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016134/0558 →
Assignment of Assignor's Interest
Dec 28, 2004
From: KIM, SHANG WON
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016134/0543 →
Assignment of Assignor's Interest
Dec 28, 2004
From: YOON, CHUL JIN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016134/0555 →
Merger
Aug 10, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016880/0859 →
Change of Name
Jan 17, 2006
From: ANAM SEMICONDUCTOR LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017476/0711 →
Change of Name
May 26, 2014
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 033018/0027 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →
Assignment of Assignor's Interest
Jun 16, 2014
From: DONGBU HITEK CO., LTD.
To: RPX CORPORATION\\
Reel/Frame 033114/0291 →
Assignment of Assignor's Interest
Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment.
Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →