IP Library Granted Patent US 7,375,019
Granted Patent B2
US 7,375,019 · App. 11/022,645 · Granted May 20, 2008

Image sensor and method for fabricating the same

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Quick Facts
Patent No.
US 7,375,019
App. No.
11/022,645
Granted
May 20, 2008
Kind
B2
Abstract

An image sensor and a method for fabricating the same are disclosed, to improve a contact quality between a contact plug and a source diffusion layer. The image sensor includes a photodiode in an active area of a semiconductor substrate, for receiving incident external light and generating optical charges; a transistor having an impurity diffusion layer electrically connected with the photodiode, for transferring/discharging the optical charges generated by the photodiode to a signal processing circuit; an impurity implantation layer having impurity selectively implanted thereto, for selectively covering the impurity diffusion layer; an insulating interlayer above the semiconductor substrate to cover the photodiode, the transistor, and the impurity implantation layer; an open hole penetrating the insulating interlayer, for selectively opening the impurity diffusion layer; and a contact plug for filling the open hole, and electrically connecting the impurity diffusion layer and a metal line provided above the insulating interlayer.

Claims (8)

1. A method for fabricating an image sensor comprising:

forming a photodiode and a transistor having an impurity diffusion layer being electrically connected with the photodiode, in an active area of a semiconductor substrate;

forming an impurity implantation layer on the substrate including a portion of the impurity diffusion layer;

selectively implanting impurities only into a portion of the impurity implantation layer covering the portion of the impurity diffusion layer;

forming an insulating interlayer above the semiconductor substrate, the insulating interlayer for covering the photodiode, the transistor, and the impurity implantation layer;

selectively opening the insulating interlayer to expose the impurity implantation layer; and

forming a contact plug for electrically connecting the impurity implantation layer of the opened area with a metal layer provided above the insulation interlayer.

2. The method of claim 1 , wherein the impurity implantation layer is formed by epitaxial growth.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
CHANGE OF NAME Recorded Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
MERGER AND CHANGE OF NAME Recorded Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →