Patent Assignment
Reel/Frame 033018/0027
Change of Name
Recorded: 2014-05-26
Pages: 24
Assignor
DONGBU ELECTRONICS CO., LTD.
Executed: 2013-07-01
Assignee
DONGBU HITEK CO., LTD.
432 TEHERAN-RO, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Properties
(3)
Cmos Image Sensor and Method for Fabricating the Same
Method for Fabricating Cmos Image Sensor
Cmos Image Sensor and Method for Fabricating the Same
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 16, 2014
From: DONGBU HITEK CO., LTD.
To: RPX CORPORATION\\
Reel/Frame 033114/0291 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Lien on Patents
Oct 21, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 050777/0983 →
Assignment of Assignor's Interest
Feb 7, 2020
From: RPX CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 051842/0494 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →