Method of fabricating high-voltage CMOS device
View Patent ↗The present invention provides a method of fabricating a high-voltage CMOS device, in which an extended drain region failing to enclose a heavily-doped drain region is separated from a high current flow path to enable high electric field concentration and breakdown to occur within a bulk of a silicon substrate and by which device reliability can be enhanced. The present invention includes the steps of forming a pad oxide layer on a substrate, forming a heavily doped drain region, a heavily doped source region, a source region, and an extended drain region failing to enclose the heavily doped drain region by ion implantation using a pattern provided on the pad oxide layer, forming a field oxide layer on a prescribed area of the extended drain region, and forming a gate and a gate spacer over the substrate.
1. A method of fabricating a high-voltage CMOS device, comprising the steps of:
forming a pad oxide layer on a substrate;
forming an extended drain region by ion implantation using a first pattern provided on the pad oxide layer;
forming a heavily doped drain region and a heavily doped source region by ion implantation using a second pattern provided on the pad oxide layer, wherein the heavily doped drain region is not enclosed by the extended drain region;
forming a source region by ion implantation using a third pattern provided on the pad oxide layer;
forming a field oxide layer on a prescribed area of the extended drain region using a fourth pattern provided on the substrate; and
forming a gate and a gate spacer over the substrate after forming the field oxide layer,
wherein the extended drain region is formed between the heavily doped drain region and the substrate.
2. The method of claim 1 , wherein if the substrate is a P type substrate, the heavily doped drain region, the heavily doped source region, and the extended drain region are doped with N type impurities and the source region is doped with P type impurities.
3. The method of claim 1 , wherein if the substrate is an N type substrate, the heavily doped drain region, the heavily doped source region, and the extended drain region are doped with P type impurities and the source region is doped with N type impurities.