Patent Assignment
Reel/Frame 033035/0680
Assignment of Assignor's Interest
Recorded: 2014-05-28
Pages: 29
Assignor
DONGBU HITEK CO., LTD.
Executed: 2014-05-22
Assignee
DSS TECHNOLOGY MANAGEMENT, INC.
1650 TYSON?S CORNER, SUITE 1580, TYSON?S CORNER, VIRGINIA, 22102
Covered Properties
(115)
Dynamic Random Access Memory and the Method for Fabricating Thereof
Patent:
6,590,248 →
Application:
09/676,211 →
Method for fabrication NOR type memory cells of nonvolatile memory device
Patent:
6,376,307 →
Application:
09/684,669 →
Method of Manufacturing Semiconductor Device
Method for Fabricating Mask Rom
Patent:
6,518,131 →
Application:
10/053,381 →
Semiconductor Package and Fabrication Method of the Same
Semiconductor Device and Method of Manufacturing Thereof
Method for Fabricating Semiconductor Device
Method for Forming Shallow Trench Isolation
Method for Fabricating Highly Integrated Transistor
Capacitor and Fabrication Method Thereof
Dram Cell Structure Capable of High Integration and Fabrication Method Thereof
Semiconductor Package and Fabrication Method of the Same
Method of Making a Mos Transistor
Patent:
6,864,178 →
Application:
10/627,059 →
Method of Forming Trench in Semiconductor Device Using Polish Stop Layer and Anti-Reflection Coating
Bonding Pad of a Semiconductor Device and Formation Method Thereof
Methods of Manufacturing Flash Memory Semiconductor Devices
Semiconductor Devices and Methods of Forming a Trench in a Semiconductor Device
Multi-Stack Chip Size Packaging Method
Thin Film Capacitor and Fabrication Method Thereof
Methods for Fabricating Semiconductor Devices
Methods of Fabricating Semiconductor Devices
Methods of Manufacturing Transistors Using Dummy Gate Patterns
Patent:
6,875,680 →
Application:
10/748,025 →
Side Braze Packages
Flash Memory with Reduced Source Resistance and Fabrication Method Thereof
Method for Fabricating and-Type Flash Memory Cell
Semiconductor Package with a Heat Spreader
Semiconductor Package and Structure Thereof
Method for Packaging a Multi-Chip Module of a Semiconductor Device
Method for Packaging a Multi-Chip Module of a Semiconductor Device
Ceramic Packaging Method Employing Flip-Chip Bonding
Method for Packaging a Semiconductor Device
Semiconductor Devices and Methods for Fabricating the Same
Method for Fabricating a Metal-Insulator-Metal Capacitor in a Semiconductor Device
Semiconductor Device and a Fabrication Method Thereof
Semiconductor Device and Fabrication Method Thereof
Method of Fabricating Flash Memory
Semiconductor Device Including Sidewall Floating Gates
Mos Transistor
Flash Memory Cell and Method for Manufacturing the Same
Method for Manufacturing Mos Transistor and Semiconductor Device Employing Mos Transistor Made Using the Same
Method of Fabricating Non-Volatile Memory Device
Isolation Methods in Semiconductor Devices
Method of Forming Gate of Flash Memory Cell
Non-Volatile Static Random Access Memory
Non-Volatile Flash Memory Device Having Dual-Bit Floating Gate
Non-Volatile Flash Memory Device
Capacitor of Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method for Fabricating the Same
Non-Volatile Memory Device
Method of Fabricating Split Gate Flash Memory Device
Method of Fabricating Mos Transistor
Method of Forming Barrier Metal in Semiconductor Device
Method of Fabricating Semiconductor Device Employing Selectivity Poly Deposition
Method for Fabricating Flash Memory Device
Non-Volatile Memory Device Having Upper and Lower Trenches and Method for Fabricating the Same
Device Isolation Structures of Semiconductor Devices and Manufacturing Methods Thereof
Devices and Methods of Preventing Plasma Charging Damage in Semiconductor Devices
Methods for Fabricating Semiconductor Devices
Method for Fabricating Semiconductor Device
Semiconductor Device and Fabricating Method Thereof
Method of Fabricating Semiconductor Device
Flash Memory Device and Method for Fabricating the Same
Method for Manufacturing a Transistor
Method for Fabricating a Nonvolatile Sonos Memory Device
Non-Volatile Memory Devices and Methods for Driving the Same
Nonvolatile Memory Device and Method for Fabricating the Same
Semiconductor Device and Method for Forming a Metal Line in the Semiconductor Device
Method for Forming a Mim Capacitor in a Semiconductor Device
Method for Manufacturing Capacitor
Metal Oxide Semiconductor Field Effect Transistor
Method for Fabricating a Trench Isolation with Spacers
Voltage-Dividing Resistor and Semiconductor Device Having the Same
Mehods of Fabricating Mim Capacitors
Flash Memory Device and Method for Fabricating the Same
Patent:
7,199,034 →
Application:
11/320,741 →
Flash Memory Device and Method for Fabricating the Same
Split Gate Type Nonvolatile Memory Device and Manufacturing Method Thereof
Patent:
7,169,672 →
Application:
11/323,821 →
Multi-Layered Copper Line Structure of Semiconductor Device and Method for Forming the Same
Semiconductor Device Having a Structure to Improve Contact Processing Margin, and Method of Fabricating the Same
Semiconductor Devices and Manufacturing Methods of the Same
Semiconductor Device Having Diffusion Barriers and a Method of Preventing Diffusion of Copper in a Metal Interconnection of a Semiconductor Device
Capacitor Device of a Semiconductor
Method of Fabricating Sram Device
Resistor of Semiconductor Device and Method for Fabricating the Same
Capacitor in Semiconductor Device and Manufacturing Method
Method of Fabricating a Transistor
Method of Forming Pip Capacitor
Phase Change Memory Device
Method of Manufacturing a Semiconductor Device
Flash Memories and Methods of Fabricating the Same
Method for Fabricating a Metal-Insulator-Metal Capacitor
Sip Semiconductor Device and Method for Manufacturing the Same
Method of Fabricating Semiconductor Device Employing Selectivity Poly Deposition
Metal Wiring and Method for Forming the Same
Flash Memory Device with Single-Poly Structure and Method for Manufacturing the Same
Nonvolatile Memory Device and Methods of Fabricating and Driving the Same
Method for Forming Mim in Semiconductor Device
Spiral Inductor
Semiconductor Device and Method of Fabricating the Same
Trench Gate-Type Mosfet Device and Method for Manufacturing the Same
Semiconductor Capacitor and Manufacturing Method
Semiconductor Device and Method for Manufacturing the Same
Method for Adhering Semiconductor Devices
Semiconductor Chip, Method of Fabricating the Same and Stacked Package Having the Same
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device and Method for Fabricating the Same
Flash Memory Device and Method for Fabricating the Same
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device Having Polysilicon Bit Line Contact
Pad in Semicondcutor Device and Fabricating Method Thereof
Semiconductor Device and Method of Fabricating the Same
Method for Fabricating Mim Structure Capacitor
Flash Memory Device
Eeprom and Method for Manufacturing Eeprom
Semiconductor Device and Method of Fabricating Semiconductor Device
Flash Memory Device and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.