Granted Patent
Utility
US 6,780,670 · App. 10/614,671
Semiconductor package and fabrication method of the same
Inventor:
Kye Chan Park
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Jul 7, 2003
Inventor
Kye Chan Park
Assignee (at issue)
Dongbu Electronics, Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.