IP Library Patent Application 10167702
Patent Application Utility
App. No. 10/167,702 · Confirmation No. 8262

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME

Inventor: Kye Chan Park
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
Code Description Pages PDF
2003-07-07 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-07 LET. Miscellaneous Incoming Letter 2 View
2002-06-12 TRNA Transmittal of New Application 3 View
2002-06-12 A.PE Preliminary Amendment 1 View
2002-06-12 SPEC Specification 13 View
2002-06-12 CLM Claims 7 View
2002-06-12 ABST Abstract 1 View
2002-06-12 DRW Drawings-only black and white line drawings 8 View
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Quick Facts
App. No.
10/167,702
Filed
2002-06-12
Granted
2003-09-30
Pub. No.
US20020190354A1
Art Unit
2815
PTA
0 days