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App. No. 10/614,671 · Confirmation No. 7330

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME

Inventor: Kye Chan Park
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2004-12-21 C.AD Change of Address 1 View
2004-06-28 IFEE Issue Fee Payment (PTO-85B) 3 View
2004-06-28 C.AD Change of Address 1 View
2004-04-08 NOA Notice of Allowance and Fees Due (PTOL-85) 6 View
2004-04-08 892 List of references cited by examiner 1 View
2004-04-08 1449 List of References cited by applicant and considered by examiner 1 View
2004-04-08 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-04-08 FWCLM Index of Claims 1 View
2004-04-08 SRFW Search information including classification, databases and other search related notes 1 View
2003-07-07 TRNA Transmittal of New Application 4 View
2003-07-07 SPEC Specification 13 View
2003-07-07 CLM Claims 7 View
2003-07-07 ABST Abstract 1 View
2003-07-07 DRW Drawings-only black and white line drawings 8 View
2003-07-07 OATH Oath or Declaration filed 8 View
2003-07-07 A.PE Preliminary Amendment 1 View
2003-07-07 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2003-07-07 IDS Information Disclosure Statement (IDS) Form (SB08) 1 View
2003-07-07 FRPR Certified Copy of Foreign Priority Application 1 View
2003-07-07 WFEE Fee Worksheet (SB06) 1 View
2003-07-07 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/614,671
Filed
2003-07-07
Granted
2004-08-24
Pub. No.
US20040007775A1
Art Unit
2815
PTA
0 days