Semiconductor package with a heat spreader
View Patent ↗A semiconductor package capable of spreading heat includes an upper PCB and a lower PCB connected to a first chip and a second chip by using gold bumps, respectively. Also the semiconductor package includes a heat spreader and thermally conductive members. The heat spreader spreads the heat generated by the first chip and the second chip. The thermally conductive members transmit the heat to the heat spreader by connecting the heat spreader to the first chip and the second chip with the thermally conductive members.
1. A semiconductor package with a heat spreader, comprising:
an upper PCB connected to a first chip;
a lower PCB connected to a second chip;
a heat spreader for spreading heat generated by the first chip and the second chip to surroundings; and
thermally conductive members for transmitting the heat generated by the first chip and the second chip to the heat spreader by connecting the heat spreader to the first chip and the second chip wherein the heat spreader is positioned between the first and second chips.
2. The semiconductor package of claim 1 , wherein the thermally conductive members are curved to form gaps between the heat spreader and the first chip and between the heat spreader and the second chip.
3. The semiconductor package of claim 1 , wherein a space in the semiconductor package is filled with epoxy mold compound (“EMC”).
4. The semiconductor package of claim 1 , wherein the thermally conductive members are disk-shaped metallic elastic bodies.
5. The semiconductor package of claim 4 , wherein the thermally conductive members are disk springs.
6. A semiconductor package with a heat spreader, comprising:
a lead frame connected to a first chip;
a lower PCB connected to a second chip;
a heat spreader for spreading heat generated by the first chip and the second chip to surroundings; and
thermally conductive members for transmitting the heat generated by the first chip and the second chip to the heat spreader by connecting the heat spreader to the first chip and the second chip wherein the heat spreader is positioned between the first and second chips.
7. The semiconductor package of claim 6 , wherein the thermally conductive members are curved to form gaps between the heat spreader and the first chip and between the heat spreader and the second chip.
8. The semiconductor package of claim 6 , wherein a space in the semiconductor package is filled with epoxy mold compound (“EMC”).
9. The semiconductor package of claim 6 , wherein the thermally conductive members are disk-shaped metallic elastic bodies.
10. The semiconductor package of claim 9 , wherein the thermally conductive members are disk springs.