IP Library › Assignment 017136/0775
Patent Assignment
Reel/Frame 017136/0775

Translation: Translation Certificate

Recorded: 2005-12-22 Pages: 10
Assignor
DONGBU ELECTRONICS CO., LTD.
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Properties (7)
Semiconductor Package with a Heat Spreader
Patent: 7,009,301 →
Application: 10/751,175 →
Publication: US 2004/0156173
Semiconductor Package and Structure Thereof
Patent: 6,949,818 →
Application: 10/751,183 →
Publication: US 2004/0227220
Method for Packaging a Multi-Chip Module of a Semiconductor Device
Patent: 7,087,459 →
Application: 10/751,198 →
Publication: US 2004/0157365
Method for Packaging a Semiconductor Device
Patent: 6,953,710 →
Application: 10/751,199 →
Publication: US 2004/0157366
Method for Packaging a Multi-Chip Module of a Semiconductor Device
Patent: 7,118,938 →
Application: 10/751,200 →
Publication: US 2004/0157374
Ceramic Packaging Method Employing Flip-Chip Bonding
Patent: 6,836,961 →
Application: 10/751,209 →
Publication: US 2004/0154164
Method for Packaging a Semiconductor Device
Patent: 7,229,849 →
Application: 10/751,212 →
Publication: US 2004/0157371
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 30, 2003
From: KOH, KYUNG HEE
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 015094/0609 →
Assignment of Assignor's Interest Dec 30, 2003
From: KANG, BYOUNG YOUNG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014870/0649 →
Assignment of Assignor's Interest Dec 30, 2003
From: KOH, KYUNG HEE
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014870/0660 →
See Recording on Reel 015094 Frame 0609. Correction of Wrong Number Assigned by Applications. Dec 30, 2003
From: KOH, KYUNG HEE
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014877/0464 →
Assignment of Assignor's Interest Dec 30, 2003
From: KANG, BYOUNG YOUNG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014882/0686 →
Assignment of Assignor's Interest Dec 30, 2003
From: JEONG, NYEON-SIK
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014866/0549 →
Assignment of Assignor's Interest Dec 30, 2003
From: PARK, JIN HO
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014866/0551 →
Assignment of Assignor's Interest Dec 30, 2003
From: KANG, BYOUNG YOUNG
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 014868/0720 →
Change of Name May 30, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017703/0499 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017703 Frame 0499. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.". Jun 28, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017854/0297 →
Assignment of Assignor's Interest May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →
Assignment of Assignor's Interest May 31, 2016
From: DSS TECHNOLOGY MANAGEMENT, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LIMITED
Reel/Frame 038755/0352 →