Patent Assignment
Reel/Frame 014870/0660
Assignment of Assignor's Interest
Recorded: 2003-12-30
Pages: 2
Assignor
KOH, KYUNG HEE
Executed: 2003-12-22
Assignee
DONGBU ELECTRONICS CO., LTD.
DONGBU FINANCIAL CENTER, 891-10, DAECHI-DONG, GANGNAM-GU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Packaging a Multi-Chip Module of a Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Translation: Translation Certificate
Dec 22, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017136/0775 →
Change of Name
May 30, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017703/0499 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017703 Frame 0499. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 28, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017854/0297 →
Assignment of Assignor's Interest
May 28, 2014
From: DONGBU HITEK CO., LTD.
To: DSS TECHNOLOGY MANAGEMENT, INC.
Reel/Frame 033035/0680 →