CMOS image sensor and method for fabricating the same

1. A method for fabricating a complementary metal-oxide semiconductor image sensor, comprising the steps of:

forming a pad insulating layer formed on a sub-layer having a photodiode and a plurality of transistors formed thereon;

forming a first insulating layer having an uneven surface on the pad insulating layer;

depositing a second insulating layer on the first insulating layer by using a high deposition plasma process;

additionally depositing the second insulating layer, so as to form a dome-shaped portion over a projected portion of an uneven surface of the first insulating; and

etching-back the second insulating layer so that the second insulating layer covers upper and side surfaces of the projected portion of the first insulating layer to form the dome-shaped portion, thereby forming a micro-lens including the projected portion of the first insulating layer and the dome-shaped portion of the second insulating layer covering the projected portion of the first insulating layer.

2. The method of claim 1 , wherein the step of etching-back is performed under a compound gas atmosphere including argon (Ar) ranging from 20 to 200 sccm, C 4 F 8 ranging from 5 to 20 sccm, CH 5 F ranging from 30 to 50 sccm, and O 2 ranging from 20 to 50 sccm, and wherein the etching-back is performed under a condition of an upper bias of 300 W, a lower bias ranging from 50 to 150 W, and a pressure ranging from 100 to 200 mTorr.

3. The method of claim 1 , wherein the step of forming a first insulating layer having an uneven surface on the pad insulating layer comprises:

depositing the first insulating layer on the pad insulating layer;

depositing a photoresist on the first insulating layer and patterning the photoresist with light-exposing and developing processes; and

etching the first insulating layer by using the patterned photoresist as a mask but not completely, so that a set thickness of the first insulating is remained, thereby preventing the pad insulating layer formed below from being exposed.

4. The method of claim 1 , wherein the first insulating layer is formed of a nitride layer.

5. The method of claim 1 , wherein second insulating layer is formed of an oxide layer, and an O 3 deposition process is performed for the additional second insulating layer deposition process.

6. The method of claim 1 , further comprising:

forming a planarization layer on an entire surface after forming the micro-lens; and

forming a color filter on the planarization layer.