Patent Assignment
Reel/Frame 016053/0865
Assignment of Assignor's Interest
Recorded: 2004-12-02
Pages: 3
Assignor
IN GYUN, JEON
Executed: 2004-12-01
Assignee
DONGBU ELECTRONICS CO., LTD.
DONGBU FINANCIAL CENTER BLDG., 32ND FLOOR, 891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Cmos Image Sensor and Method for Fabricating the Same
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Aug 10, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016880/0859 →
Change of Name
Jul 13, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018099/0281 →
Change of Name
May 26, 2014
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 033018/0027 →
Assignment of Assignor's Interest
Jun 16, 2014
From: DONGBU HITEK CO., LTD.
To: RPX CORPORATION\\
Reel/Frame 033114/0291 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →