Patent Assignment
Reel/Frame 017436/0472
Assignment of Assignor's Interest
Recorded: 2005-12-30
Pages: 3
Assignors
CHOI, SANG HYUN
Executed: 2005-12-16
HWANG, WOONG LIN
Executed: 2005-12-16
CHOI, SEOG MOON
Executed: 2005-12-16
PARK, HO JOON
Executed: 2005-12-16
LEE, SUNG JUN
Executed: 2005-12-16
LIM, CHANG HYUN
Executed: 2005-12-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Diode Package and Fabrication Method Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger
Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
Assignment of Assignor's Interest
Jun 6, 2022
From: SAMSUNG ELECTRONICS CO., LTD
To: SMART HANDOVER, LLC
Reel/Frame 060115/0467 →
Assignment of Assignor's Interest
Apr 7, 2023
From: SMART HANDOVER LLC
To: SEMILED INNOVATIONS LLC
Reel/Frame 063256/0139 →
Corrective Assignment to Correct the the Assigne Name Previously Recorded at Reel: 63256 Frame: 139. Assignor(S) Hereby Confirms the Assignment.
Oct 3, 2024
From: SMART HANDOVER LLC
To: SEMILED INNOVATIONS LLC
Reel/Frame 069112/0494 →