Patent Assignment
Reel/Frame 017439/0362
Assignment of Assignor's Interest
Recorded: 2006-01-05
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Featuring Copper Wiring Layers of Different Widths Having Metal Capping Layers of Different Thickness Formed Thereon, and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.