Patent Assignment
Reel/Frame 017443/0583
Assignment of Assignor's Interest
Recorded: 2006-01-03
Pages: 2
Assignors
SOHN, SEUNG H.
Executed: 2005-12-13
CHUNG, YUL K.
Executed: 2005-12-13
JIN, HYUN J.
Executed: 2005-12-13
PARK, EUN T.
Executed: 2005-12-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGDONG-GU, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Printed Circuit Board Having Embedded Multi-Layer Passive Devices