Patent Assignment
Reel/Frame 017444/0641
Assignment of Assignor's Interest
Recorded: 2006-01-06
Pages: 3
Assignor
PARK, SUNG-SOO
Executed: 2005-12-21
Assignee
SAMSUNG CORNING CO., LTD.
472 SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer structure and epitaxial growth method for growing the same
Application:
11/326,172 →
Publication:
US 2006/0151797
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger.
May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →