IP Library › Assignment 017452/0942
Patent Assignment
Reel/Frame 017452/0942

Assignment of Assignor's Interest

Recorded: 2006-01-05 Pages: 3
Assignors
TAKAHASHI, HIDEYUKI
Executed: 2005-12-19
IKEYA, KIYOKAZU
Executed: 2005-12-19
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, DALLAS, TEXAS, 75266
Covered Property (1)
Contact Assembly and Socket for Use with Semiconductor Packages
Patent: 7,217,140 →
Application: 11/326,302 →
Publication: US 2006/0192264
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 28, 2006
From: TEXAS INSTRUMENTS INCORPORATED
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 018029/0118 →
Assignment of Assignor's Interest May 29, 2008
From: SENSATA TECHNOLOGIES, INC.
To: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
Reel/Frame 021018/0690 →
Security Agreement Aug 28, 2008
From: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 021450/0563 →
Release of Security Interest May 17, 2011
From: MORGAN STANLEY & CO. INCORPORATED
To: SENSATA TECHNOLOGIES FINANCE COMPANY, LLC; SENSATA TECHNOLOGIES, INC.; SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
Reel/Frame 026293/0352 →
Merger Feb 11, 2022
From: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 058992/0576 →
Assignment of Assignor's Interest Oct 7, 2022
From: SENSATA TECHNOLOGIES, INC.
To: LTI HOLDINGS, INC.
Reel/Frame 061350/0370 →