IP Library Assignment 061350/0370
Patent Assignment
Reel/Frame 061350/0370

Assignment of Assignor's Interest

Recorded: 2022-10-07 Pages: 14
Assignor
SENSATA TECHNOLOGIES, INC.
Executed: 2022-07-01
Assignee
LTI HOLDINGS, INC.
5960 INGLEWOOD DRIVE, SUITE 115, PLEASANTON, CALIFORNIA, 94588
Covered Properties (25)
Semiconductor Test Socket with a Floating Plate and Latch for Holding the Semiconductor Device
Socket
Patent: 6,848,928 →
Application: 10/301,191 →
Publication: US 2003/0100201
Socket for Mounting an Electronic Device
Patent: 6,749,443 →
Application: 10/313,272 →
Publication: US 2003/0114034
Integrated Circuit Temperature Sensing Device and Method
Patent: 7,123,037 →
Application: 10/920,531 →
Publication: US 2005/0189957
Burn-In Testing Apparatus and Method
Patent: 7,042,240 →
Application: 11/069,589 →
Publication: US 2005/0206368
Contact Assembly and Socket for Use with Semiconductor Packages
Patent: 7,217,140 →
Application: 11/326,302 →
Publication: US 2006/0192264
Burn-In Testing Apparatus and Method
Patent: 7,187,189 →
Application: 11/367,983 →
Publication: US 2006/0145718
Temperature Sensing and Prediction in Ic Sockets
Patent: 7,394,271 →
Application: 11/368,283 →
Publication: US 2006/0164111
Burn-In Sockets for Bga Ic Devices Having an Integrated Slider with Full Ball Grid Compatibility
Patent: 7,318,736 →
Application: 11/463,114 →
Burn-In Testing Apparatus and Method
Patent: 7,312,620 →
Application: 11/562,294 →
Publication: US 2007/0075721
Burn-In Testing Apparatus and Method
Patent: 7,482,825 →
Application: 11/929,569 →
Publication: US 2008/0054926
Socket Adaptor Apparatus
Patent: 7,601,008 →
Application: 12/136,460 →
Publication: US 2009/0017703
Semiconductor Device Burn-in Test Socket
Patent: 8,388,365 →
Application: 12/734,933 →
Publication: US 2010/0248518
Socket
Patent: 8,602,805 →
Application: 13/251,348 →
Publication: US 2012/0129379
Apparatus and Method for Ramping and Controlling the Temperature of a Component Using a Vortex Tube
Patent: 8,937,482 →
Application: 13/531,093 →
Package on Package Thermal Forcing Device
Patent: 9,594,113 →
Application: 14/186,733 →
Publication: US 2015/0241478
Direct Injection Phase Change Temperature Control System
Patent: 9,709,622 →
Application: 14/210,084 →
Publication: US 2014/0260333
Connector Having a Contact with Contact Surfaces Inclined in Opposite Directions
Patent: 9,350,100 →
Application: 14/527,847 →
Publication: US 2015/0126071
Socket for Reducing Size and Operating Force
Patent: 9,368,889 →
Application: 14/566,760 →
Publication: US 2015/0171530
Thermal Clutch for Thermal Control Unit and Methods Related Thereto
Patent: 9,921,265 →
Application: 14/973,900 →
Publication: US 2017/0176515
Interface Structure
Application: 15/376,286 →
Publication: US 2017/0171985
Free Piston Stirling Cooler Temperature Control System for Semiconductor Test
Application: 15/404,650 →
Publication: US 2018/0196102
Socket
Application: 16/108,585 →
Publication: US 2019/0064214
Semiconductor Test Socket with a Floating Plate and Latch for Holding the Semiconductor Device
Application: 16/694,011 →
Publication: US 2021/0156906
Controlling Refrigeration Loop Expansion Value Flow and Compressor Speed Under Conditions of Rapid Heat Load Changes
Application: 63/302,495 →
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 16, 2012
From: LEMCZYK, TOM
To: WELLS-CTI, LLC
Reel/Frame 028966/0237 →
Assignment of Assignor's Interest Oct 16, 2012
From: WELLS-CTI, LLC
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 029139/0219 →
Release of Security Interest Nov 30, 2012
From: SILICON VALLEY BANK
To: WELLS-CTI LLC
Reel/Frame 029430/0786 →
Assignment of Assignor's Interest Jun 25, 2014
From: LOPEZ, CHRISTOPHER A.; LEMCZYK, THOMAS F.; DAVIS, RICK A.
To: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
Reel/Frame 033174/0151 →
Assignment of Assignor's Interest Oct 30, 2014
From: TAKAHASHI, HIDEYUKI
To: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
Reel/Frame 034068/0163 →
Assignment of Assignor's Interest Jul 30, 2015
From: DAVIS, RICK A.; LOPEZ, CHRISTOPHER
To: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
Reel/Frame 036215/0833 →
Merger Jul 26, 2016
From: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 039255/0941 →
Assignment of Assignor's Interest Feb 11, 2022
From: TAKAHASHI, HIDEYUKI
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 058991/0281 →
Merger Feb 11, 2022
From: SENSATA TECHNOLOGIES MASSACHUSETTS, INC.
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 058992/0576 →