IP Library Granted Patent US 7,601,008
Granted Patent B2
US 7,601,008 · App. 12/136,460 · Granted Oct 13, 2009

Socket adaptor apparatus

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Quick Facts
Patent No.
US 7,601,008
App. No.
12/136,460
Granted
Oct 13, 2009
Kind
B2
Abstract

A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14 . An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60 . The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.

Claims (7)

1. A socket adaptor for connection to a socket that mounts a semiconductor device comprises a main adaptor body made of an electrically insulating material, a plurality of through holes formed therethrough, said through holes including an upper opening and a lower opening, a probe pin made of electrically conductive material accommodlated in each said through hole, each probe pin having a clip portion that electrically engages a contact inserted from said upper surface opening and each probe pin having on its lower part a tip portion that can protrude from said lower opening, a slot formed along the through hole and in communication therewith in said main adaptor body, with said probe pin being able to slide inside said slot, and a spring member accommodated in each through hole to bias said probe pin so that said tip portion can protrude from the lower opening, said tip portion movable back through the through hole in opposition to the bias of said spring member, wherein said main adaptor body comprises an upper and a lower adaptor portion with said upper adaptor portion including a protuberant part that protrudes into the imaginary continuation of the through hole of the lower adaptor portion, said protuberant part causing directly the limiting movement of one end of said spring member that has been accommodated in the through hole of the lower adaptor portion.

2. A socket adaptor according to claim 1 in which the protuberant part that protrudes into the imaginary continuation of the through holes in the lower adaptor portion comprise a pair of tabs that are formed on the upper adaptor portion at the lower portion of each through hole.

3. A socket according to claim 1 wherein the through holes have a longitudinal axis and the shape of the through holes of said upper adaptor portion with respect to a cross-section taken perpendicular to the longitudinal axis of the upper adaptor portion through holes is approximately rectangular and the shape of the through holes of said lower adaptor portion with respect to a cross-section taken perpendicular to the longitudinal axis of the lower adaptor portion through holes is approximately circular defining the protuberant part that protrudes into the imaginary continuation of the through holes of the lower adaptor portion.

4. A socket adaptor according to claim 1 where said spring member is a coil spring that includes a contact part for electrically engaging the contact that is inserted from said upper opening.

5. A socket adaptor for connection to a socket that mounts a semiconductor device comprises a main body made of an electrically insulating material, a plurality of through holes formed therethrough, said through holes including an upper opening and a lower opening, a probe pin made of electrically conductive material accommodated in each said through hole, each probe pin having a clip portion that electrically engages a contact inserted from said upper surface opening and each probe pin having on its lower part a tip portion that can protrude from said lower opening and a coil spring member accommodated in each through hole to bias said probe pin so that said tip portion can protrude form the lower opening, said tip portion movable back through the through hole in opposition to the bias of said coil spring member, wherein each probe pin has a base and said clipping portion comprises a pair of arms extending longitudinally from the base which are elastically deformable a protrusion pan is formed on each arm extending laterally toward the opposing arm and a protuberant pin extends longitudinally from the base intermediate to the pair of arms, said coil spring member is accommodated between said pair of arms over the protuberant pin extending from said base.

6. A socket adaptor according to claim 5 where said main adaptor body includes a positioning through hole whose purpose is to determine the position for fixing the socket.

7. A socket adaptor for connection to a socket that mounts a semiconductor device comprises a main body made of an electrically insulating material, a plurality of through holes formed therethrough, said through holes including an upper opening and a lower opening, a probe pin made of electrically conductive material accommodated in each said through hole, each probe pin having a clip portion that electrically engages a contact inserted from said upper surface opening and each probe pin having on its lower pan a tip portion that can protrude from said lower opening and a coil spring member accommodated in each through hole to bias said probe pin so that said tip portion can protrude from the lower opening, said tip portion movable back through the through hole in opposition to the bias of said coil spring member, wherein each probe pin has a base and said clipping portion comprises a pair of arms extending longitudinally from the base which are elastically deformable a protrusion part is formed on each arm extending laterally toward the opposing arm, and said coil spring member is accommodated between said pair of arms on said base.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2022
From: SENSATA TECHNOLOGIES, INC.
To: LTI HOLDINGS, INC.
Reel/Frame 061350/0370 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2008
From: TAKAHASHI, HIDEYUKI; IKEYA, KIYOKAZU
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 021073/0730 →