Integrated circuit temperature sensing device and method
View Patent ↗An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC. The method of sensing the temperature of an IC includes actively changing the temperature of an IC with a heater or cooler, sensing the temperature of the IC with a temperature sensor positioned within a conductive sensor housing in thermal contact with the IC and thermally insulating the sensor housing and temperature sensor from the heater or cooler.
1. An integrated circuit temperature controlling arrangement comprising:
a temperature control block thermally contacting an integrated circuit, wherein the temperature control block effects a change in integrated circuit temperature by conducting heat to or from the integrated circuit; and
an integrated circuit temperature sensing device positioned within the temperature control block, including:
a temperature sensor located to thermally contact the integrated circuit;
a sensor housing containing the temperature sensor and composed of a conductive material to physically contact the integrated circuit and to physically isolate the temperature sensor from the integrated circuit; and
an insulating material arranged to thermally isolate the temperature sensor from the temperature control block.
2. The arrangement of claim 1 , wherein the conductive material is a highly conductive metal.
3. The arrangement of claim 1 , wherein the conductive material comprises copper or aluminum and the insulating material is formed of a polythermide material.
4. The arrangement of claim 1 , wherein the conductive material spaces the temperature sensor from the integrated circuit a predetermined distance to provide a thermal path for fast transient response to temperature changes of the integrated circuit.
5. The arrangement of claim 4 , wherein the conductive material spaces the temperature sensor from the integrated circuit so that the temperature sensor or integrated circuit is physically protected from damage otherwise resulting from contact between the temperature sensor and the integrated circuit.
6. The arrangement of claim 1 , wherein the conductive material is shaped so that a flat surface contacts the integrated circuit.
7. The arrangement of claim 1 wherein the temperature control block includes a cylindrical through-bore sized and shaped to receive the insulating material, the sensor housing, and the temperature sensor as a unit.
8. The arrangement of claim 7 wherein the sensor housing is generally cylindrically shaped and arranged to receive the temperature sensor in a cylindrical cavity, the cavity having an opening at a first end of the housing and the cavity extending toward a second end of the housing.
9. The arrangement of claim 8 wherein the temperature sensor comprises a generally cylindrical tip located in the cylindrical cavity of the sensor housing.
10. The arrangement of claim 8 wherein the insulating material comprises an annular sleeve surrounding the generally cylindrically shaped sensor housing.
11. The arrangement of claim 10 wherein the second end of the sensor housing is exposed from the insulating material to form a thermally conductive path from the integrated circuit to the temperature sensor.