IP Library Assignment 029430/0786
Patent Assignment
Reel/Frame 029430/0786

Release of Security Interest

Recorded: 2012-11-30 Pages: 2
Assignor
SILICON VALLEY BANK
Executed: 2012-11-27
Assignee
WELLS-CTI LLC
1499 SE TECH CENTER PLACE, SUITE 140, VANCOUVER, WASHINGTON, 98683
Covered Properties (19)
Zero Insertion Socket with Normally Closed Contacts
Patent: 4,836,798 →
Application: 07/135,731 →
Modular Socket for an Integrated Circuit
Patent: 5,074,798 →
Application: 07/426,302 →
Latching Ic Connector
Patent: 5,120,238 →
Application: 07/670,741 →
Chip Carrier Socket
Patent: 5,205,756 →
Application: 07/826,968 →
Socket for Integrated Circuit Carrier
Patent: 5,228,866 →
Application: 07/908,048 →
Socket for Positioning and Installing an Intergrated Circuit Chip on a Flexible Connector Sheet
Patent: 6,162,066 →
Application: 08/857,239 →
Test Contactor
Patent: 5,990,693 →
Application: 08/929,956 →
Test Socket for Electronic Module
Patent: 6,045,370 →
Application: 08/942,505 →
Computer-Assisted Education Using Video Conferencing
Patent: 6,336,813 →
Application: 09/002,999 →
Integrated Circuit Test Socket Having Torsion Wire Contacts
Patent: 6,217,341 →
Application: 09/285,233 →
Socket for Positioning and Installing an Integrated Circuit on a Circuit Board
Patent: 6,162,080 →
Application: 09/299,375 →
Method and Device with Variable Resilience Springs for Testing Integrated Circuit Packages
Patent: 7,030,638 →
Application: 10/627,953 →
Publication: US 2005/0017742
Integrated Circuit Temperature Sensing Device and Method
Patent: 7,123,037 →
Application: 10/920,531 →
Publication: US 2005/0189957
Multi-Site Chip Carrier and Method
Patent: 7,108,517 →
Application: 10/952,644 →
Publication: US 2006/0068614
Burn-In Testing Apparatus and Method
Patent: 7,042,240 →
Application: 11/069,589 →
Publication: US 2005/0206368
Burn-In Testing Apparatus and Method
Patent: 7,187,189 →
Application: 11/367,983 →
Publication: US 2006/0145718
Temperature Sensing and Prediction in Ic Sockets
Patent: 7,394,271 →
Application: 11/368,283 →
Publication: US 2006/0164111
Integrated Circuit Temperature Sensing Device and Method
Application: 11/428,243 →
Publication: US 2006/0238212
Temperature Control in Ic Sockets
Application: 11/459,288 →
Publication: US 2006/0290370
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 16, 2012
From: WELLS-CTI, LLC
To: SENSATA TECHNOLOGIES, INC.
Reel/Frame 029139/0219 →
Release Nov 30, 2012
From: SILICON VALLEY BANK
To: WELLS-CTI LLC
Reel/Frame 029430/0791 →
Security Agreement Jan 15, 2014
From: NCR CORPORATION; NCR INTERNATIONAL, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 032034/0010 →
Assignment of Assignor's Interest Oct 7, 2022
From: SENSATA TECHNOLOGIES, INC.
To: LTI HOLDINGS, INC.
Reel/Frame 061350/0370 →
Release of Patent Security Interest Oct 25, 2023
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: NCR VOYIX CORPORATION
Reel/Frame 065346/0531 →