Patent Assignment
Reel/Frame 017457/0014
Assignment of Assignor's Interest
Recorded: 2005-07-06
Pages: 3
Assignors
ARIFUKU, MOTOHIRO
Executed: 2005-06-06
WATANABE, ITSUO
Executed: 2005-06-06
GOTOU, YASUSHI
Executed: 2005-06-06
KOBAYASHI, KOUJI
Executed: 2005-06-06
KOJIMA, KAZUYOSHI
Executed: 2005-06-06
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0449, JAPAN
Covered Property
(1)
Circuit Connecting Material, Film-Like Circuit Connecting Material Using the Same, Circuit Member Connecting Structure, and Method of Producing the Same