Patent Assignment
Reel/Frame 017464/0848
Assignment of Assignor's Interest
Recorded: 2006-01-18
Pages: 3
Assignor
KATOU, TOSHIKAZU
Executed: 2006-01-10
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Flip-Chip Semiconductor Device with Improved Power Pad Arrangement
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.