IP Library Assignment 017465/0658
Patent Assignment
Reel/Frame 017465/0658

Assignment of Assignor's Interest

Recorded: 2006-01-11 Pages: 2
Assignor
HIROI, MASAYUKI
Executed: 2005-12-22
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property (1)
Semiconductor Device with Multiple Interconnect Layers and Vias
Patent: 7,663,240 →
Application: 11/329,045 →
Publication: US 2006/0170108
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0815 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →