Patent Assignment
Reel/Frame 017466/0993
Assignment of Assignor's Interest
Recorded: 2006-01-18
Pages: 3
Assignors
YAMADA, KAORU
Executed: 2005-12-26
SAITO, TAKAYUKI
Executed: 2005-12-26
YABE, SUMIO
Executed: 2005-12-26
ITO, KENYA
Executed: 2005-12-26
KAMEZAWA, MASAYUKI
Executed: 2005-12-26
SEKI, MASAYA
Executed: 2005-12-26
KATAKABE, ICHIRO
Executed: 2005-12-26
INOUE, YUKI
Executed: 2005-12-26
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method, and Substrate Holding Apparatus