Patent Assignment
Reel/Frame 017470/0056
Assignment of Assignor's Interest
Recorded: 2006-04-13
Pages: 3
Assignors
YABE, HIDEKI
Executed: 2006-03-29
SAKAI, YUICHI
Executed: 2006-03-29
KAWAMA, YOSHITATSU
Executed: 2006-03-29
KUMAGAI, MUNEHITO
Executed: 2006-03-29
NAKAOKA, YASUYUKI
Executed: 2006-03-29
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Sensor Chip Breaking Strength Inspection Apparatus and Sensor Chip Breaking Strength Inspection Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.