IP Library › Assignment 017500/0570
Patent Assignment
Reel/Frame 017500/0570

Assignment of Assignor's Interest

Recorded: 2006-01-23 Pages: 2
Assignors
SHINADA, HIROYUKI
Executed: 2002-06-17
MURAKOSHI, HISAYA
Executed: 2002-06-17
TODOKORO, HIDEO
Executed: 2002-06-25
MAKINO, HIROSHI
Executed: 2002-06-17
ANAN, YOSHIHIRO
Executed: 2002-06-20
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHISHINBASHI, 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Apparatus and Method for Wafer Pattern Inspection
Patent: 7,982,188 →
Application: 11/336,895 →
Publication: US 2006/0249676
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Address Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →