Patent Assignment
Reel/Frame 017514/0230
Assignment of Assignor's Interest
Recorded: 2006-01-25
Pages: 2
Assignor
JEONG, KWANG-JIN
Executed: 2006-01-09
Assignee
SAMSUNG SDI CO., LTD.
575, SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-731, KOREA, REPUBLIC OF
Covered Property
(1)
Structure for Heat Dissipation of Integrated Circuit Chip and Display Module Including the Same