Patent Assignment
Reel/Frame 017516/0775
Assignment of Assignor's Interest
Recorded: 2006-01-25
Pages: 4
Assignors
CHENG, TAMMY
Executed: 2006-01-16
DOBRZELEWSKI, MARK
Executed: 2006-01-23
WINDIATE, CHRISTOPHER
Executed: 2006-01-23
SOLOMON, DANIEL
Executed: 2006-01-23
Assignee
DOW CORNING CORPORATION
2200 W. SALZBURG ROAD, MAIL NUMBER C01232 P.O. BOX 994, MIDLAND, MICHIGAN, 48686-0994
Covered Property
(1)
Process for Fabricating Electronic Components Using Liquid Injection Molding