Patent Assignment
Reel/Frame 017543/0558
Assignment of Assignor's Interest
Recorded: 2006-02-06
Pages: 2
Assignors
HIROSE, TETSUYA
Executed: 2006-01-11
SHINONAGA, NAOYUKI
Executed: 2006-01-10
OSAKA, SHUICHI
Executed: 2006-01-10
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-6334, JAPAN
Covered Property
(1)
Semiconductor Device Including Capsule Type Semiconductor Package and Semiconductor Chip in Stacking Manner
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.