Patent Assignment
Reel/Frame 017556/0764
Assignment of Assignor's Interest
Recorded: 2006-05-01
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming an Insulation Layer Structure Having a Concave Surface and Method of Manufacturing a Memory Device Using the Same