Patent Assignment
Reel/Frame 017557/0080
Assignment of Assignor's Interest
Recorded: 2006-02-13
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Ultrasonic Bonding Equipment for Manufacturing Semiconductor Device, Semiconductor Device and Its Manufacturing Method