Patent Assignment
Reel/Frame 017571/0175
Assignment of Assignor's Interest
Recorded: 2006-05-02
Pages: 3
Assignor
JENG, SHIN-PUU
Executed: 2006-02-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, R.O.C., TAIWAN
Covered Property
(1)
Method for Forming a Dielectric Layer with an Air Gap, and a Structure Including the Dielectric Layer with the Air Gap