IP Library › Assignment 017573/0047
Patent Assignment
Reel/Frame 017573/0047

Assignment of Assignor's Interest

Recorded: 2006-02-15 Pages: 3
Assignors
KANAYA, YASUHIKO
Executed: 2005-11-16
IRIE, AKIRA
Executed: 2005-11-16
NAGASAWA, KATSUHIRO
Executed: 2005-11-16
YUKI, TORU
Executed: 2005-11-16
Assignee
HITACHI VIA MECHANICS, LTD.
2100 KAMI-IMAIZUMI, EBINA-SHI, KANAGAWA, JAPAN
Covered Property (1)
Manufacturing Method of a Multi-Layered Circuit Board
Patent: 7,488,676 →
Application: 11/297,358 →
Publication: US 2006/0127652
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →