Patent Assignment
Reel/Frame 032600/0580
Change of Name
Recorded: 2014-04-03
Pages: 15
Assignor
HITACHI VIA MECHANICS, LTD.
Executed: 2013-11-01
Assignee
VIA MECHANICS, LTD.
2100, KAMIIMAIZUMI, EBINA-SHI, KANAGAWA, JAPAN
Covered Properties
(75)
Printed-Circuit Board Holding Device
Patent:
5,876,156 →
Application:
08/701,590 →
Laser Beam Machining and Laser Beam Machine
Patent:
6,521,866 →
Application:
09/623,809 →
Device and Method for Processing Substrates
Printed Board Processing Machine
Printed Circuit Board Processing Machine
Controller for Optical Scanner
Method for Drilling Holes in a Substrate
Beam or Wave Front
Correction of Angular Deviation and Radial Drift of Laser Beams
System and Method for Generating and Controlling Multiple Independently Steerable Laser Beam for Material Processing
Gray Level Imaging Masks, Optical Imaging Apparatus for Gray Level Imaging Masks and Methods for Encoding Mask and Use of the Masks
Machining Method and Machining Apparatus
Multi-Axis Laser Machine, Method for Machining with the Same, and Recording Medium Recording Computer Program for Controlling the Same
Multibeam Laser Drilling Apparatus
Laser Machining Apparatus
Printed Board Machining Apparatus
Laser Machining Apparatus and Laser Machining Method
Scanner System
Laser Machining Method and Laser Machining Apparatus
Optical Scanner Control Method, Optical Scanner and Laser Machining Apparatus
Spindle Unit Having Pressure Foot
Machining Apparatus
Substrate Processing Apparatus
Compensator Optics to Improve the Stability of Beam Delivery Systems That Utilize Beam Shaping Technology
Laser Machining Apparatus
Servo Control System for Movable Body, and Laser Drilling Machine
Pattern Exposure Method and Pattern Exposure Apparatus
Apparatus and Method for Beam Drift Compensation
Laser Machining Apparatus for Sheet-Like Workpiece
Method for Drilling Holes in a Substrate, in Particular an Electrical Circuit Substrate, by Means of a Laser Beam
Laser Machining Apparatus
Printed Board Drilling Method and Printed Board Machining Apparatus
Method for Determining Position of Reference Point
Gray Level Imaging Masks, Optical Imaging Apparatus for Gray Level Imaging Masks and Methods for Encoding Mask and Use of the Masks
Fiber Laser Based Production of Laser Drilled Microvias for Multi-Layer Drilling, Dicing, Trimming or Milling Applications
Tool Positioning Device and Machining Tool
Fluorescence Based Laser Alignment and Testing of Complex Beam Delivery Systems and Lenses
Beam Shaping Prior to Harmonic Generation for Increased Stability of Laser Beam Shaping Post Harmonic Gereration with Integrated Automatic Displacement and Thermal Beam Drift Compensation
Method and Device for Holding Sheet-Like Workpiece
Displacement and Flatness Measurements by Use of a Laser with Diffractive Optic Beam Shaping and a Multiple Point Sensor Array Using the Back Reflection of an Illuminating Laser Beam
Manufacturing Method of a Multi-Layered Circuit Board
Method and Apparatus for Laser Perforating Printed Circuit Board
Exposure Apparatus and Exposing Method and Method of Manufacturing a Printed Wiring Board
Inspection Method and Apparatus for Partially Drilled Microvias
Digital Servo Control Unit and Laser Machining Apparatus
Manufacturing Method of Printed Wiring Board as Well as Copper-Clad Laminate and Treatment Solutions Used Therefor
Scanner for Equalizing Torque Constant and Reducing Torque Constant Variation
Drilling Method
Exposure Apparatus and Exposure Method, and Method of Manufacturing Electrical Wiring Board
Beam Shaping Prior to Harmonic Generation for Increased Stability of Laser Beam Shaping Post Harmonic Generation with Integrated Automatic Displacement and Thermal Beam Drift Compensation
Apparatus and Methods for the Inspection of Microvias in Printed Circuit Boards
Laser Machining Method and Laser Machining Apparatus
Positioning Control System for Moving Element and Laser Drilling Machine
Device for Changing Pitch Between Light Beam Axes, and Substrate Exposure Apparatus
Rocking Actuator and Laser Machining Apparatus
Substrate Exposure Apparatus and Illumination Apparatus
Laser Machining Method and Laser Machining Apparatus
Drilling Method and Laser Machining Apparatus
Fabrication Method of Printed Circuit Board and Printed Circuit Board Machining Apparatus
Drawing Apparatus
Machining Apparatus for Drilling Printed Circuit Board
Workpiece Machining Apparatus
Laser Energy Measuring Unit and Laser Machining Apparatus
Printed Circuit Board and Method of Manufacturing the Same
Printed Circuit Board Machinging Apparatus
Laser Direct Imaging Apparatus
Laser Direct Imaging Apparatus and Imaging Method
Method for Manufacturing Printed Wiring Board and Electrolytic Etching Solution for Use in the Manufacturing Method
Method for Manufacturing Three Dimensional Electrode Elements for Micro-Batteries
Method and Apparatus for Perforating Printed Circuit Board
Fiber Laser Based Production of Laser Drilled Microvias for Multi-Layer Drilling, Dicing, Trimming or Milling Applications
Machining Apparatus and Machining Method
Method and Apparatus for Machining Thin-Film Layer of Workpiece
Application:
13/254,155 →
Publication:
US 2012/0031147
Galvanoscanner and Laser Processing Machine
Laser Machining Method, Laser Machining Apparatus, and Laser Machining Program
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 1996
From: YAMAURA, KOUJI; OTANI, TAMIO; IRIE, AKIRA
To: HITACHI SEIKO LTD.
Reel/Frame 008177/0694 →
Change of Name
Jul 26, 1999
From: HITACHI SEIKO, LTD.
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 010113/0824 →
Assignment of Assignor's Interest
Sep 8, 2000
From: ARAI, KUNIO; WATANABE, HUMIO
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 011112/0100 →
Assignment of Assignor's Interest
Mar 22, 2001
From: NAGASAWA, KATSUHIRO; OTANI, TAMIO; IRIE, AKIRA
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 011614/0884 →
Assignment of Assignor's Interest
Apr 24, 2001
From: ITO, YASUSHI; IRIE, AKIRA
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 011773/0053 →
Assignment of Assignor's Interest
Nov 30, 2001
From: TOYAMA, SOUICHI; HIRAI, HIROMU; NAKAJIMA, KICHIO; SAKAMOTO, ATSUSHI
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 012340/0141 →
Re-Record to Correct to Spelling of First Inventor's Name Previously Recorded at Reel/Frame 012340/0141.
Mar 29, 2002
From: TOHYAMA, SOUICHI; HIRAI, HIROMU; NAKAJIMA, KICHIO; SAKAMOTO, ATSUSHI
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 012738/0657 →
Assignment of Assignor's Interest
Jun 19, 2002
From: WIGGERMANN, UDO; SCHREINER, ALEX; MAYER,HANS JURGEN; HIGGINS, LEO
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 013017/0019 →
Assignment of Assignor's Interest
Mar 11, 2003
From: LIZOTTE, TODD E.
To: NANOVIA LP
Reel/Frame 013861/0819 →
Assignment of Assignor's Interest
Apr 10, 2003
From: LIZOTTE, TODD E.
To: NANOVIA, LP
Reel/Frame 013959/0497 →
Assignment of Assignor's Interest
Apr 10, 2003
From: LIZOTTE, TODD E.; OHAR, OREST
To: NANOVIA, LP
Reel/Frame 013965/0175 →
Assignment of Assignor's Interest
Jun 18, 2003
From: LIZOTTE, TODD E.
To: NANOVIA, LP
Reel/Frame 014202/0255 →
Assignment of Assignor's Interest
Jun 30, 2003
From: DE STEUR, HUBERT; KILTHAU, ALEXANDER; KLETTI, ANDRE; MAYER, HANS JUERGEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 014221/0282 →
Assignment of Assignor's Interest
Oct 3, 2003
From: NANOVIA LP
To: HITACHI DIGITAL GRAPHICS (USA) INC.
Reel/Frame 014549/0890 →
Assignment of Assignor's Interest
Oct 7, 2003
From: WATANABE, KAZUO; YAMASHITA, TAKAHIKO; ITO, YASUSHI; NAGASAWA, KATSUHIRO
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 014597/0527 →
Assignment of Assignor's Interest
Oct 28, 2003
From: NANOVIA LP
To: HITACHI DIGITAL GRAPHICS (USA), INC.
Reel/Frame 014631/0431 →
Assignment of Assignor's Interest
Dec 22, 2003
From: ARAI, KUNIO; SUZUKI, KENJI
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 014831/0156 →
Assignment of Assignor's Interest
Apr 6, 2004
From: HITACHI DIGITAL GRAPHICS (USA), INC.
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 015178/0326 →
Assignment of Assignor's Interest
May 21, 2004
From: HATA, IZUMI; NISHIMURA, TOSHIYA; TATEISHI, HIDENORI; SHIMIZU, YASUYUKI
To: HITACHI VIA MECHANICS LTD.
Reel/Frame 015358/0840 →
Assignment of Assignor's Interest
Aug 2, 2004
From: MORI, SADAO; SUGAWARA, HIROYUKI; AOYAMA, HIROSHI
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 015640/0662 →
Assignment of Assignor's Interest
Aug 13, 2004
From: KADO, HIROFUMI; ITO, YASUSHI; SUZUKI, NOBUHIKO
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 015680/0385 →
Assignment of Assignor's Interest
Jan 3, 2005
From: TOYAMA, SOUICHI; OTSUKI, HARUAKI; SAKAMOTO, ATSUSHI; SEKI, KENTA
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 016118/0746 →
Assignment of Assignor's Interest
Jun 6, 2005
From: ITO, YASUSHI; NARUSE, FUTAO; MARUYAMA, OSAMU
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 016659/0820 →
Assignment of Assignor's Interest
Jan 13, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017198/0048 →
Assignment of Assignor's Interest
Mar 13, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 017666/0270 →