Laser machining method, laser machining apparatus, and laser machining program
View Patent ↗Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S 1 ). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S 2 ). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S 3 ). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S 4 ).
1. A laser machining method for performing a plurality of drill machining on a printed circuit board with a laser beam, comprising:
providing a scanning means for scanning the laser beam onto a surface of the printed circuit board in an X direction and a Y direction, the laser beam being emitted from a laser beam source;
providing an XY table for moving the printed circuit board in the X direction and the Y direction;
dividing the printed circuit board to be scanned by the laser beam into a plurality of scan areas;
sorting an order of drilling within each scan area to obtain a scanning route with a shortest distance;
swapping the order of the (N+1)th hole and the (N+2)th hole, in each scanning area, if it is determined that the distance between the N-th hole and the (N+1)th hole (here, N is an integer in a range of “1≦N≦“the maximum number of holes to be drilled in the area“−1) is less than a predetermined threshold value, and that the (N+1)th hole does not correspond to the maximum number of the holes to be drilled in the scanning area; and
machining each scanning area, specifically in machining the N-th hole and then machining the (N+1)th hole after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value.
2. A laser machining apparatus, comprising
a controller for performing the laser machining method according to claim 1 .
3. A computer-readable storage medium storing a laser machining program for performing the laser machining method according to claim 1 by a controller of a laser machining apparatus.