IP Library Granted Patent US 7,959,385
Granted Patent B2
US 7,959,385 · App. 12/153,591 · Granted Jun 14, 2011

Printed circuit board machining apparatus

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Quick Facts
Patent No.
US 7,959,385
App. No.
12/153,591
Granted
Jun 14, 2011
Kind
B2
Abstract

A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.

Claims (14)

1. A printed circuit board machining apparatus, comprising:

a table;

a spindle rotatable and movable up and down while holding a tool for machining a printed circuit board mounted on the table; and

a pressure unit for pressing the printed circuit board to the table in machining the printed circuit board;

wherein the pressure unit, comprising:

an elevating member movable up and down along the spindle;

a moving member having a plurality of pressure pieces each having a through hole formed to pass through the tool, configured so as to allow one among the plurality of pressure pieces to be selected and held by the elevating member;

a driving section for moving the moving member so that the through hole of the pressure piece is aligned with an axial center of the tool;

an elevation driving section for moving the elevating member up and down to press the selected pressure piece to the printed circuit board; and

a control section for controlling the driving section and the elevation driving section;

wherein the control section controlling the driving section so as to select the pressure piece in accordance to a type and diameter of the tool and controlling the elevation driving section so as to change force for pressing the printed circuit board corresponding to the selected pressure piece.

2. The printed circuit board machining apparatus according to claim 1 , wherein at least one pressure piece among the plurality of pressure pieces has a ringed brush for pressing the printed circuit board.

3. The printed circuit board machining apparatus according to claim 1 , further comprising a detecting section for detecting a predetermined relative moving distance between the tool and the pressure piece;

wherein the spindle stops machining when the detecting section detects the predetermined relative moving distance.

Assignments (2)
CHANGE OF NAME Recorded Apr 3, 2014
From: HITACHI VIA MECHANICS, LTD.
To: VIA MECHANICS, LTD.
Reel/Frame 032600/0580 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2008
From: KADO, HIROFUMI; KAMATA, HIROYUKI; TAKAHASHI, SHINTARO; NAGASAWA, KATSUHIRO
To: HITACHI VIA MECHANICS, LTD.
Reel/Frame 021041/0072 →